1/4 rev. b structure silicon monolithic ic product high-side switch for universal serial bus (usb) type BD2224G features low on-resistance (typ. 150m ? ) n-channel mosfet built-in 500ma continuous load current over-current protection thermal shutdown open-drain fault flag output under-voltage lockout soft-start circuit input voltage range: 2.7v ~ 5.5v active-high control logic ssop5 package absolute maximum ratings (t a = 25 o c) parameter symbol rating unit vin supply voltage v in -0.3 ~ 6.0 v en input voltage v en -0.3 ~ 6.0 v /oc voltage v /oc -0.3 ~ 6.0 v /oc sink current i /oc 5 ma vout voltage v out -0.3 ~ v in + 0.3 v storage temperature t stg -55 ~ 150 o c power dissipation (*1) p d 675 mw (*1) mounted on 70mm x 70mm x 1.6mm glass epoxy board. reduce 5.4mw per 1 o c above 25 o c. operating conditions parameter symbol min. typ. max. unit vin operating voltage v in 2.7 5.0 5.5 v operating temperature t opr -40 - 85 o c continuous load current i out 0 - 500 ma this ic is not designed to be radiation-proof.
2/4 rev. b electrical characteristics v in = 5v, t a = 25 o c, unless otherwise specified. dc characteristics parameter symbol min. typ. max. unit conditions operating current i dd - 110 160 av en = 5v, vout= open standby current i stb - 0.01 5 av en = 0v, vout= open en input voltage v en 2.0 - - v high input v en - - 0.8 v low input en input leakage i en -1 0.01 1 av en = 0v or 5v on-resistance r on - 150 200 m ? i out = 50ma over-current threshold i th 550 780 1000 ma short circuit output current i sc 350 - - ma v out = 0v, rms /oc output low voltage v /oc - - 0.4 v i /oc = 0.5ma uvlo threshold v tuv 2.1 2.3 2.5 v v in increasing 2.0 2.2 2.4 v v in decreasing ac characteristics parameter symbol min. typ. max. unit conditions turn-on rise time t on1 - 1 6 ms r l = 20 ? turn-on delay time t on2 - 1.5 10 ms r l = 20 ? turn-off fall time t off1 - 1 20 s r l = 20 ? turn-off delay time t off2 - 3 40 s r l = 20 ? /oc delay time t /oc 10 15 20 ms timing chart t on1 t off1 90% 10% 10% t on2 t off2 50% 50% 90% en vout vout i out /oc t /oc over-current detection i sc turn-on time and turn-off time over-current protection over-current load removed i th
3/4 rev. b block diagram pin description pin no. name i/o function 1 vin - switch input and the supply voltage for the ic. 2 gnd - ground. 3 en i active-high enable input. high level input turns on the switch. 4 /oc o over-current noti fication terminal. low level output during over-current or over-temperature condition. open-drain fault flag output. 5 vout o switch output. package outline package : ssop5 unit : mm drawing no. ex106-5001-2 under-voltage lockout charge pump en delay counter over-current protection thermal shutdown vin /oc gnd vout d a lot no.
4/4 rev. b cautions on use (1) absolute maximum ratings an excess in the absolute maximum ratings, such as supply vo ltage, temperature range of operating conditions, etc., can break down devices, thus making impossible to i dentify breaking mode such as a short circ uit or an open circuit. if any special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety measures including the use of fuses, etc. (2) power supply and gnd line design pcb pattern to provide low impedance for the wiring between the power supply and the gnd lines. pay attention to the interference by common impedance of layout pattern when there are plural power supplies and gnd lines. especially, when there are gnd pattern for small signal and gnd pattern for lar ge current included the external circuits, separate each gnd pattern. furthermore, for all power supply terminals to ics, mount a capacitor between the power supply and the gnd terminal. a t the same time, in order to use a capacitor, thoroughly check to be sure the characteristics of the capacitor to be used present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant. (3) gnd voltage make setting of the potential of the gnd terminal so that it will be maintained at the minimum in any operating state. furthermore, check to be sure no terminals are at a potenti al lower than the gnd voltage including an actual electric transient. (4) short circuit between terminals and erroneous mounting in order to mount ics on a set pcb, pay thorough attention to the direction and offset of the ics. erroneous mounting can break down the ics. furthermore, if a short circuit occurs due to foreign matters entering between terminals or between the terminal and the power supply or the gnd terminal, the ics can break down. (5) operation in strong electromagnetic field be noted that using ics in the strong el ectromagnetic field can malfunction them. (6) input terminals in terms of the construction of ic, parasitic elements are i nevitably formed in relation to potential. the operation of the parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the input terminal. therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals a voltage lower than the gnd respectively, so that any parasitic element will operate. furthermore, do not apply a voltage to the input terminals when no power supply voltage is applied to t he ic. in addition, even if the power supply voltage is applied , apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of electrical characteristics. (7) external capacitor in order to use a ceramic capacitor as the external capaci tor, determine the constant wi th consideration given to a degradation in the nominal capacitance due to dc bias and changes in the capacitance due to temperature, etc. (8) thermal shutdown circuit (tsd) when junction temperatures becom e detected temperatures or higher, the t hermal shutdown circuit operates and turns a switch off. the thermal shutdown circuit, which is aimed at isolating the lsi from thermal runaway as much as possible, is not aimed at the protection or guarantee of the lsi. therefor e, do not continuously use the lsi with this circuit operating or use the lsi assuming its operation. (9) thermal design perform thermal design in which there are adequate ma rgins by taking into account the power dissipation (p d ) in actual states of use.
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